JPS6236301Y2 - - Google Patents
Info
- Publication number
- JPS6236301Y2 JPS6236301Y2 JP15392981U JP15392981U JPS6236301Y2 JP S6236301 Y2 JPS6236301 Y2 JP S6236301Y2 JP 15392981 U JP15392981 U JP 15392981U JP 15392981 U JP15392981 U JP 15392981U JP S6236301 Y2 JPS6236301 Y2 JP S6236301Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor device
- lead
- leads
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15392981U JPS5858355U (ja) | 1981-10-15 | 1981-10-15 | 半導体素子用パツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15392981U JPS5858355U (ja) | 1981-10-15 | 1981-10-15 | 半導体素子用パツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5858355U JPS5858355U (ja) | 1983-04-20 |
| JPS6236301Y2 true JPS6236301Y2 (en]) | 1987-09-16 |
Family
ID=29946531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15392981U Granted JPS5858355U (ja) | 1981-10-15 | 1981-10-15 | 半導体素子用パツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5858355U (en]) |
-
1981
- 1981-10-15 JP JP15392981U patent/JPS5858355U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5858355U (ja) | 1983-04-20 |
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